Alcatel Lucent O-010S-P GPON Teardown

On a recent DSL-Reports thread I noticed that Alcatel-Lucent O-010S-P was marked as untested. I ordered a used one to take apart and see what was inside. For reference, here it is next to a Nokia G-010S-A(with infamous SFP linkup issue). As we can see, the cases are quite different, in addition to the different fiber connectors/polishes (SC/APC and SC/UPC).

First to go are these little tabs on the right(other matching tab on other side of SFP). These can be bent out with a steel probe from the end of the SFP.

Next, the outer case/shield just sort of slides off. Note this will likely scratch your labels and jack up your thermal pad if it is old and dry.

Removing the heatsink we can see a Broadcom chip under it. Due to stains from the heatsink insert, it's a little hard to read the number, but I believe it to be BCM685131FBG, BCM685161FBG, or BCM685181FBG.

From the side, we can see this is indeed a lot of electronics in a small package, with two PCBs soldered together, and what I would guess is RAM in the middle. Also, you need to smoosh the laser module and PCB assembly together a bit like shown before continuing.

Apologies for this next shot, but to remove the PCB, you need to continue smooshing the PCB assembly towards the laser until the PCB can be rotated up and off the metal notches like shown.

Apologies again for not taking the last photo of the back - the main feature is a Spansion FL256SAIF00 3v, 256mbit/32MByte Quad-SPI Flash.